Silicon Wafer Etching and Cleaning Machine - PP Corrosion-Resistant Equipment | Baisheng Tech
Product IDpp-wafer-etch-cleanerPP Corrosion-Resistant EquipmentCleaning Equipment
PP Corrosion-Resistant Equipment

Silicon Wafer Etching and Cleaning Machine

Product Overview

A silicon wafer etching and cleaning machine removes surface oxide, particles and metal ions from wafers, and is one of the core wet-process tools in solar cell and semiconductor manufacturing. The machine is built entirely in PP, facing hydrofluoric and nitric acid directly. Wafers are transported immersed in solution and polished in that state, so neither floating transport nor roller-applied liquid is needed. There are therefore no etch lines, the process is stable and easy to control, and breakage rates are lower.

Features & Specifications

►**Material**:imported porcelain-white polypropylene (PP) sheet with matching PP welding rod ►**Fabrication**:seamless welded one-piece construction, semi-permanent, no metal parts and therefore no rusting ►**Corrosion resistance**:resists strong acids, strong alkalis and chemical reagents; impact resistant ►**Customisation**:dimensions, sheet thickness, door count, hinge direction and viewing panels all designed to requirement ►**Key specifications**: workpiece 2″~6″ wafers (25 per basket, single or double basket) ►**Machine dimensions**: 2000×1200×1800mm ►**Control**: manual / semi-automatic ►**Efficiency gain**: 0.2%~0.3% depending on the baseline process
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Email:sales@baisheng-tech.com

Phone+886-2-25981958

Detailed Description

Post-diffusion polishing and wet etching in one tool

Conventionally, post-diffusion polishing and wet etching are two machines and two process steps. This tool integrates both, requiring no additional equipment investment and adding no process step. The process avoids NaOH, HNO3 and H2SO4 in favour of a dedicated polishing solution, which lowers chemical consumption cost, reduces effluent contamination and cuts treatment cost with it. Rear-surface polishing stacks with mainstream technologies — SE, rear passivation (AL2O3), back contact, double printing and MWT — so compatibility is good and system integration or modularisation is straightforward.

Selection References

Before ordering, verify the efficiency grade, media type, and whether the operating environment fits your requirements.