Supercritical CO₂ Purifier - Gas Purifiers | Baisheng Tech
Product IDBSS32-SCGas PurifiersFully Automatic Purifiers
Gas Purifiers

Supercritical CO₂ Purifier

Product Overview

Purification equipment designed for supercritical carbon dioxide processes. Multiple adsorption beds in parallel alternate between ambient purification and high-temperature regeneration, with dedicated removal targets for NO, NO₂, SO₂ and non-volatile hydrocarbons that affect supercritical drying quality. Flow covers 10–700 Nm³/h.

Features & Specifications

Performance table (applicable gas: supercritical CO₂)

ImpurityBSS32-SC outlet (ppb)
ProcessADS
H₂O< 1
Total volatile acids (as SO₂)< 0.1
NO< 0.1
NO₂< 0.1
SO₂< 0.005
Total volatile bases (as NH₃)< 1
NH₃< 0.5
Non-volatile hydrocarbons NVHC (as toluene)< 0.01
Particles≤ 1 pcs/m³ (@0.003μm)
Flow range10–700 Nm³/h
The table lists the specification and configuration of standard models only; please enquire for other special requirements.
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Detailed Description

Why supercritical CO₂ needs its own specification

Supercritical carbon dioxide combines the diffusivity of a gas with the solvent power of a liquid, allowing it to carry liquid out of high-aspect-ratio structures without surface tension. That makes it the drying medium for advanced-node wafers, preventing pattern collapse. Precisely because it is a strong solvent, non-volatile hydrocarbons (NVHC) in the source gas dissolve under supercritical conditions and precipitate onto the wafer surface on depressurisation; acidic impurities such as NO, NO₂ and SO₂ can corrode metal layers. The controlled items for supercritical-grade CO₂ therefore differ from ordinary high-purity CO₂ — the emphasis is on NVHC and acidic gases, not just moisture.

Process description

The BSS32-SC series runs multiple adsorption beds in parallel, alternating between ambient purification and high-temperature regeneration, with a service life of over 20 years.

Product features

・NVHC (as toluene) < 0.01 ppb, designed around the key metric for supercritical drying ・SO₂ < 0.005 ppb, suppressing the risk of metal corrosion ・NO and NO₂ both < 0.1 ppb ・Fully automatic operation with 24-hour uninterrupted supply ・Outlet particles ≤ 1 pcs/m³ (@0.003 μm)

Processes and industries served

・Supercritical drying at advanced nodes: collapse-free drying of high-aspect-ratio patterns ・Post-clean processing of high-aspect-ratio structures: FinFET, GAA and 3D NAND ・Release drying of MEMS devices, preventing stiction ・Supercritical extraction and material processing where residue requirements are strict ・Supercritical process development in research institutes

Installation and layout notes

High-pressure system design: the working pressure of supercritical CO₂ is far above ordinary gas supply, so pipework, valves and safety devices must share the same pressure rating Phase control: temperature and pressure must be controlled along the path from gas through liquid to supercritical, avoiding unintended phase change that causes dry ice or water hammer Control NVHC sources throughout: the purifier cleans the gas, but grease and seal outgassing downstream contribute NVHC just as readily, so the whole chain needs low-outgassing materials Relief and discharge: depressurising the supercritical section produces rapid volumetric expansion and a sharp temperature drop, so the discharge route must be able to take it Asphyxiation risk: CO₂ accumulates in low-lying areas, so the equipment room needs ventilation and oxygen monitoring Agree the verification method in advance: analysis of NVHC and ppb-level acidic gases needs dedicated methods and sampling procedures

Maintenance and regeneration

・Adsorption beds regenerate automatically on a PLC schedule, with adsorbent designed for over 20 years ・For routine NVHC monitoring, build a trend from periodic sampling — a single data point means little ・Routine maintenance focuses on valve actuation, temperature control and sensor calibration, and the condition of upstream vaporisation and pressurisation equipment ・Any part removed must be confirmed free of grease before refitting, as it affects the NVHC figure directly

Choosing between neighbouring models

ModelMain controlled itemsNVHC figureWhere it fits
BSS32-SC (this model)NVHC, NO / NO₂ / SO₂< 0.01 ppbSupercritical drying
BSS32Acids, bases, refractory compoundsNot separately controlledGeneral high-purity CO₂
BSS33As BSS32 plus CH₄Not separately controlledSource contains methane

Frequently asked questions

Can an ordinary high-purity CO₂ purifier be used for a supercritical process?

It can be connected, but the controlled items do not match. Ordinary models do not separately control NVHC, and NVHC is precisely the residue source that causes problems in supercritical drying. The consequence of the wrong model usually does not appear immediately — it shows up gradually in the wafer surface defect rate.

What exactly is NVHC?

Non-volatile hydrocarbon: the general term for hydrocarbons that do not evaporate readily at ambient temperature and pressure — grease, plasticisers and the outgassing products of some sealing materials all belong to this class. Their effect in ordinary gas phase is limited, but supercritical CO₂ dissolves them and precipitates them onto the wafer on depressurisation.

Does the equipment itself contribute NVHC?

All wetted parts are cleaned accordingly. The real risk lies in site installation and later maintenance — any untreated gasket, lubricant or tool oil can introduce NVHC into the system, which makes the construction specification and maintenance procedure as important as the equipment selection.