이산화탄소 정제기 - 가스 정제기 | Baisheng Tech
품번BSS32가스 정제기전자동 정제기
가스 정제기

이산화탄소 정제기

제품 개요

대유량 이산화탄소 정제기입니다. BSS32는 여러 개의 흡착 탑을 병렬로 둔 흡착식이고, BSS33은 앞단에 고온 촉매 탑을 직렬로 연결하여 CH₄를 추가로 제거합니다. 총 휘발성 산과 난융성 화합물을 0.005 ppb 이하로 제어할 수 있으며 유량은 10~700 Nm³/h입니다.

제품 특성

Index Table (Applicable gas: CO₂)

ImpurityBSS32 Outlet (ppb)BSS33 Outlet (ppb)
ProcessADSCAT+ADS
H₂O< 1< 1
O₂< 1< 1
CO< 1< 1
H₂< 1< 1
CH₄< 1
Total volatile acids (as SO₂)< 0.005< 0.005
Total volatile bases (as NH₃)< 0.5< 0.5
Condensable organics (HCS>100 amu, as decane)< 0.15< 0.15
Non-condensable organics (HCS>58 amu, as toluene)< 1< 1
Refractory compounds (as HMDSO)< 0.005< 0.005
Particles≤ 1 pcs/m³ (@0.003μm)≤ 1 pcs/m³ (@0.003μm)
Flow range10–700 Nm³/h10–700 Nm³/h
Only the specifications and configurations of standard models are listed. Please contact us for special requirements.
견적 문의

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상세 설명

Process Description

The BSS32 series runs multiple adsorption beds in parallel, alternating between ambient-temperature purification and high-temperature regeneration, with a service life over 20 years. The BSS33 series adds a catalytic bed in series ahead of the adsorption beds. The catalytic bed operates at high temperature and needs no regeneration; the downstream adsorption beds run in parallel with the same alternating cycle. The difference is that BSS33 additionally removes CH₄.

Applications

High-purity carbon dioxide is used in wafer cleaning, supercritical drying and certain deposition processes. Volatile acids, bases and refractory compounds in the source gas can leave residues or cause corrosion on the wafer surface even at ppb levels, so process requirements commonly call for ppb or lower outlet specifications.

Product Features

・Fully automatic operation with 24-hour uninterrupted supply ・Custom adsorbent materials with dedicated removal design for acids, bases and refractory compounds ・Bursting discs and relief valves for pressure release, high-temperature mechanical interlock and alarms