NIPPON MUKI
Nouvelle TGMML Low-Organic / Low-Boron ULPA Filter
Product Overview
TGMML is a low-organic + low-boron mini-pleats ULPA filter with 99.9995% efficiency @ 0.1 μm. Controls both organic and boron outgassing simultaneously — the highest-grade ULPA for leading-edge semiconductor processes and photoresist-sensitive zones.
Key features
・ULPA 99.9995% @ 0.1 μm
・Simultaneous low-organic + low-boron
・Mini-pleats construction (low PD)
・Standard for AMC-sensitive zones at sub-14 nm
Target industries：Medical, Pharmaceutical, Electronics
Features & Specifications
| No. | Model | Efficiency | W (mm) | H (mm) | D (mm) | Airflow (CMM) | Airflow (CMH) | Initial PD (Pa) |
|---|---|---|---|---|---|---|---|---|
| 1 | TGMML-Z-E41 | 99.9995%@0.1μm | 305 | 305 | 65 | 2.0 | 120 | 147 |
| 2 | TGMML-Z-E41 | 99.9995%@0.1μm | 305 | 610 | 65 | 4.5 | 270 | 147 |
| 3 | TGMML-Z-E41 | 99.9995%@0.1μm | 457 | 457 | 65 | 5.0 | 300 | 147 |
| 4 | TGMML-Z-E41 | 99.9995%@0.1μm | 610 | 610 | 65 | 10.0 | 598 | 147 |
| 5 | TGMML-Z-E41 | 99.9995%@0.1μm | 762 | 610 | 65 | 12.5 | 750 | 147 |
| 6 | TGMML-Z-E41 | 99.9995%@0.1μm | 915 | 610 | 65 | 15.0 | 900 | 147 |
| 7 | TGMML-Z-E41 | 99.9995%@0.1μm | 1220 | 610 | 65 | 20.5 | 1230 | 147 |
| 8 | TGMML-Z-E41 | 99.9995%@0.1μm | 1500 | 915 | 65 | 39.0 | 2340 | 147 |
| 9 | TGMML-Z-E38 | 99.9995%@0.1μm | 305 | 305 | 98 | 2.0 | 120 | 118 |
| 10 | TGMML-Z-E38 | 99.9995%@0.1μm | 305 | 610 | 98 | 4.5 | 270 | 118 |
| 11 | TGMML-Z-E38 | 99.9995%@0.1μm | 457 | 457 | 98 | 5.5 | 328 | 118 |
| 12 | TGMML-Z-E38 | 99.9995%@0.1μm | 610 | 610 | 98 | 10.0 | 600 | 118 |
| 13 | TGMML-Z-E38 | 99.9995%@0.1μm | 762 | 610 | 98 | 12.5 | 750 | 118 |
| 14 | TGMML-Z-E38 | 99.9995%@0.1μm | 915 | 610 | 98 | 15.5 | 930 | 118 |
| 15 | TGMML-Z-E38 | 99.9995%@0.1μm | 1500 | 915 | 98 | 39.5 | 2370 | 118 |
Detailed Description
TGMML addresses both of the AMCs that matter most in semiconductor fabs: organics (amines, carbamates) and boron. Used in lithography bays and photoresist coating/developing areas sensitive to both contaminant classes.
Materials & Construction
| Property | Specification |
|---|---|
| Filter frame | ALUMINUM |
| Media | GLASS PAPER |
| Max. temperature | 60°C |
| Relative humidity | 60%RH |
| Separator | HOT MELT ADHESIVE |
| Gasket | EPDM |
| Grille (downstream) | - |
| Grille (upstream) | - |
| Sealant | POLYURETHANE RESIN |
| Max airflow | Can be calculated on request |
| Max final PD (Pa) | 294 |
Airflow vs Pressure Drop (representative)
Applications
- Around EUV / DUV lithography equipment - Photoresist coating and development zones - Leading-edge wafer fabs (sub-14 nm)Selection Notes
- Low-boron only → BGMML is more economical. - Low-organic only → contact Nippon Muki for options. - Both required → choose TGMML (highest grade).Selection References
Before ordering, verify the efficiency grade, media type, and whether the operating environment fits your requirements.
