NIPPON MUKI
Iochemix ECSL Recirculation Ion-Exchange Resin Filter
Product Overview
ECSL is a mini-pleats chemical filter with ion-exchange resin media, ~90% efficiency. Ultra-low PD (12-35 Pa) suits recirculated-air filtration in semiconductor cleanrooms for acidic gases (HF, HCl, SO2).
Key features
・Ion-exchange resin media
・Ultra-low PD (12-35 Pa)
・Mini-pleats construction
・Chemical filtration for recirculated cleanroom air
Target industries：Electronics
Features & Specifications
| No. | Model | Efficiency | W (mm) | H (mm) | D (mm) | Airflow (CMM) | Airflow (CMH) | Initial PD (Pa) |
|---|---|---|---|---|---|---|---|---|
| 1 | ECSL-Z-S-E-*1 | Approx. 90%*2 | 289 | 594 | 50 | 3.0 | 180 | Approx. 12 |
| 2 | ECSL-7-S-E-*1 | Approx. 90%*2 | 610 | 610 | 50 | 7.0 | 420 | Approx. 12 |
| 3 | ECSL-Z-S-E-*1 | Approx. 90%*2 | 1220 | 610 | 50 | 14.0 | 840 | Approx. 12 |
| 4 | ECSL-Z-RS-E-*1 | Approx. 90%*2 | 289 | 594 | 65 | 4.0 | 240 | Approx. 20 |
| 5 | ECSL-10-RS-E-*1 | Approx. 90%*2 | 610 | 610 | 65 | 10.0 | 600 | Approx. 20 |
| 6 | ECSL-Z-RS-E-*1 | Approx. 90%*2 | 1220 | 610 | 65 | 20.5 | 1230 | Approx. 20 |
| 7 | ECSL-Z-R-E-*1 | Approx. 90%*2 | 289 | 594 | 75 | 4.0 | 240 | Approx. 35 |
| 8 | ECSL-10-R-E-*1 | Approx. 90%*2 | 610 | 610 | 75 | 10.0 | 600 | Approx. 35 |
| 9 | ECSL-Z-R-E-*1 | Approx. 90%*2 | 1220 | 610 | 75 | 20.5 | 1230 | Approx. 35 |
Detailed Description
Iochemix ECSL is engineered for recirculated-air systems in semiconductor cleanrooms, outperforming conventional activated carbon for acidic AMCs (HF, HCl). Ultra-low PD allows retrofitting onto existing FFUs.
Materials & Construction
| Property | Specification |
|---|---|
| Filter frame | ALUMINUM |
| Media | Ion exchange resin |
| Max. temperature | 40°C |
| Relative humidity | 90%RH |
| Separator | HOT MELT ADHESIVE |
| Gasket | EPDM |
| Sealant | POLYURETHANE RESIN |
| Max airflow | Can be calculated on request |
Airflow vs Pressure Drop (representative)
Applications
- Acid-gas removal in semiconductor recirculated air - Chemical filtration downstream of wafer-fab FFUs - Acidic gas control in lithography zonesSelection Notes
- For alkaline gases (NH3), choose ACGM / ACGL (activated carbon). - For acidic gases, choose ECSL (this model, ion-exchange resin). - Depth selection: shallow = lowest PD; deeper = longer service life.Selection References
Before ordering, verify the efficiency grade, media type, and whether the operating environment fits your requirements.
