BGMML Low-Boron ULPA Filter

Product Overview

BGMML is a low-boron mini-pleats ULPA filter with 99.9995% efficiency @ 0.1-0.2 μm. Low-boron glass-fiber media prevents filter-borne boron contamination in semiconductor processes — standard for 14 nm and below. Key features ・ULPA 99.9995% @ 0.1-0.2 μm ・Low-boron glass-fiber media (< 10 ppm B) ・Mini-pleats construction (low PD) ・Standard for sub-14 nm semiconductor processes Target industries：Medical, Pharmaceutical, Electronics

Features & Specifications

No.	Model	Efficiency	W (mm)	H (mm)	D (mm)	Airflow (CMM)	Airflow (CMH)	Initial PD (Pa)
1	BGMML-Z-E41	99.9995%@0.1-0.2μm	305	305	65	2.0	120	147
2	BGMML-Z-E41	99.9995%@0.1-0.2μm	305	610	65	4.5	270	147
3	BGMML-Z-E41	99.9995%@0.1-0.2μm	457	457	65	5.0	300	147
4	BGMML-Z-E41	99.9995%@0.1-0.2μm	610	610	65	10.0	598	147
5	BGMML-Z-E41	99.9995%@0.1-0.2μm	762	610	65	12.5	750	147
6	BGMML-Z-E41	99.9995%@0.1-0.2μm	915	610	65	15.0	900	147
7	BGMML-Z-E41	99.9995%@0.1-0.2μm	1220	610	65	20.5	1230	147
8	BGMML-Z-E41	99.9995%@0.1-0.2μm	1500	1220	65	52.5	3150	147
9	BGMML-Z-E38	99.9995%@0.1-0.2μm	305	305	98	2.0	120	118
10	BGMML-Z-E38	99.9995%@0.1-0.2μm	305	610	98	4.5	270	118
11	BGMML-Z-E38	99.9995%@0.1-0.2μm	457	457	98	5.0	300	118
12	BGMML-Z-E38	99.9995%@0.1-0.2μm	610	610	98	10.0	598	118
13	BGMML-Z-E38	99.9995%@0.1-0.2μm	762	610	98	12.5	750	118
14	BGMML-Z-E38	99.9995%@0.1-0.2μm	915	610	98	15.0	900	118
15	BGMML-Z-E38	99.9995%@0.1-0.2μm	1500	1220	98	52.5	3150	118

LINE @baisheng

Email：sales@baisheng-tech.com

Phone：+886-2-25981958

Detailed Description

BGMML is engineered for advanced semiconductor nodes (≤14 nm). Boron in standard ULPA media can outgas in high-purity airflow and cause unintended p-type doping; BGMML uses low-boron glass fiber with <10 ppm B release.

Materials & Construction

Property	Specification
Filter frame	ALUMINUM
Media	GLASS PAPER
Max. temperature	60°C
Relative humidity	60%RH
Separator	HOT MELT ADHESIVE
Gasket	CHLOROPRENE
Grille (downstream)	-
Grille (upstream)	-
Sealant	POLYURETHANE RESIN
Max airflow	Can be calculated on request
Max final PD (Pa)	294 (245 when H>760)

Airflow vs Pressure Drop (representative)

Representative curves for 1220×610 mm units. 98 mm depth has the lowest PD.

Applications

- Sub-14 nm semiconductor advanced processes - Lithography bays in wafer fabs - Around photoresist coating / exposure equipment

Selection Notes

- If low-organic is also required, choose TGMML. - For general semiconductor, ATMML is more economical. - Mini-pleats design — lower PD than BGMC (separator type).