NIPPON MUKI 전용관
ATMCU 무바인더 저발진 350°C 내열 HEPA 필터
제품 개요
ATMCU는 연속 사용 온도 350°C(피크 400°C × 1h)의 내열 HEPA 필터로, 제약 공장 탈파이로젠 터널과 고온 무진 공정을 위해 설계했습니다. 스테인리스 프레임과 세퍼레이터, 유리섬유 여과지, 유리섬유 실링을 써서 전부 무기 구조이며 유기 바인더가 들어 있지 않아, 반복되는 열 사이클을 견디면서 안정적인 성능을 유지합니다.
주요 특징
・350°C 연속 사용, 단시간 피크 400°C × 1h
・여과 효율 99.99% @ 0.3 μm
・세퍼레이터형 HEPA 구조(스테인리스 지지)
・전 금속+유리 구조, 유기물 아웃가스 없음
・150 mm (Q)와 290 mm (P) 두 가지 깊이 제공
・무바인더 구조: 여재와 실링 모두 유기 접착제를 쓰지 않아 저발진, 실록산 방출 없음
적용 산업: 제약, 의료, 전자, 발전, 원자력
제품 특성
| No. | Model | Efficiency | W (mm) | H (mm) | D (mm) | Airflow (CMM) | Airflow (CMH) | Initial PD (Pa) |
|---|---|---|---|---|---|---|---|---|
| 1 | ATMCU-Z-Q-FS4HR | 99.99%@0.3μm | 305 | 610 | 150 | 11.0 | 660 | 250 |
| 2 | ATMCU-Z-Q-FS4HR | 99.99%@0.3μm | 457 | 457 | 150 | 12.5 | 750 | 250 |
| 3 | ATMCU-24-Q-FS4HR | 99.99%@0.3μm | 610 | 610 | 150 | 24.0 | 1440 | 250 |
| 4 | ATMCU-Z-Q-FS4HR | 99.99%@0.3μm | 915 | 610 | 150 | 36.5 | 2190 | 250 |
| 5 | ATMCU-Z-P-FS4HR | 99.99%@0.3μm | 305 | 610 | 290 | 16.0 | 960 | 250 |
| 6 | ATMCU-Z-P-FS4HR | 99.99%@0.3μm | 457 | 610 | 290 | 25.5 | 1530 | 250 |
| 7 | ATMCU-35-P-FS4HR | 99.99%@0.3μm | 610 | 610 | 290 | 35.0 | 2100 | 250 |
| 8 | ATMCU-Z-P-FS4HR | 99.99%@0.3μm | 762 | 610 | 290 | 44.0 | 2640 | 250 |
상세 설명
ATMCU is designed for continuous operation in high-temperature clean processes where standard HEPA filters fail. Its all-inorganic construction (stainless steel + glass) eliminates organic outgassing that could contaminate sensitive processes, making it the filter of choice for depyrogenation tunnels in pharmaceutical manufacturing.
Materials & Construction
| Property | Specification |
|---|---|
| Filter frame | STAINLESS STEEL |
| Media | GLASS PAPER |
| Max. temperature | 350°C (Max. 400°C/1h) |
| Separator | STAINLESS STEEL |
| Gasket | GLASS PAPER |
| Grille (downstream) | - |
| Grille (upstream) | - |
| Sealant | GLASS FIBER |
| Max airflow | Can be calculated on request |
| Max final PD (Pa) | 500 |
Airflow vs Pressure Drop (representative)
Binder-Free, Low-Shedding Construction
A conventional HEPA bonds and seals its media and frame with polyurethane (PU) or silicone, and those sealants are generally rated for long-term service somewhere in the 100–200°C range. Above that, the adhesive first softens and cracks, releasing organic molecules, then embrittles and flakes under repeated thermal cycling — at which point the filter itself becomes a particle source. ATMCU uses no organic adhesive anywhere: sealing is done with glass fiber, the frame and separators are stainless steel, and the entire assembly is metal and glass only.| Component | Conventional adhesive HEPA | ATMCU (binder-free) |
|---|---|---|
| Sealant | Polyurethane / silicone | GLASS FIBER |
| Media bonding | Organic binder | None (glass paper) |
| Separator | Aluminium foil + hot-melt | STAINLESS STEEL |
| Outgassing at temperature | Organic molecules, siloxane | None |
| Shedding after thermal cycling | Rises as adhesive degrades | Stays stable |
With no organic adhesive there is nothing to thermally decompose. Two practical consequences follow:
- Low particle shedding — degrading, flaking adhesive is the most common source of self-generated particles in high-temperature filters. A binder-free build keeps downstream particle counts from creeping back up as the filter ages through repeated heat-up and cool-down cycles.
- No siloxane contamination — silicone seals release siloxane at elevated temperature, and siloxane deposited on wafers, optical surfaces or coated substrates causes hazing and yield loss. Semiconductor, optical coating and OLED processes are particularly sensitive to this.
Depyrogenation tunnels cycle up and down in temperature every day and run continuously — the duty cycle where adhesive degradation shows up fastest. A binder-free build keeps ATMCU downstream particle counts consistent across the full service life, avoiding the case where counts rise before the filter ever reaches its terminal pressure drop.
