NIPPON MUKI
Nouvelle TGML Low-Organic / Low-Boron HEPA Filter
Product Overview
TGML is a simultaneous low-organic + low-boron mini-pleats HEPA filter with 99.99% efficiency @ 0.3 μm. Combines the low-PD advantage of mini-pleats with control over both AMC classes — the top grade for sub-14 nm process FFUs.
Key features
・Simultaneous low-organic + low-boron
・HEPA 99.99% @ 0.3 μm
・Mini-pleats construction (low PD)
・Top grade for advanced process FFUs
Target industries：Medical, Pharmaceutical, Electronics
Features & Specifications
| No. | Model | Efficiency | W (mm) | H (mm) | D (mm) | Airflow (CMM) | Airflow (CMH) | Initial PD (Pa) |
|---|---|---|---|---|---|---|---|---|
| 1 | TGML-10-E25 | 99.99%@0.3μm | 610 | 610 | 50 | 10.0 | 598 | 127 |
| 2 | TGML-20-E25 | 99.99%@0.3μm | 1220 | 610 | 50 | 20.5 | 1232 | 127 |
| 3 | TGML-Z-E41 | 99.99%@0.3μm | 305 | 305 | 65 | 2.0 | 120 | 98 |
| 4 | TGML-Z-E41 | 99.99%@0.3μm | 457 | 457 | 65 | 5.0 | 300 | 98 |
| 5 | TGML-Z-E41 | 99.99%@0.3μm | 305 | 610 | 65 | 4.5 | 270 | 98 |
| 6 | TGML-10-E41 | 99.99%@0.3μm | 610 | 610 | 65 | 10.0 | 600 | 98 |
| 7 | TGML-Z-E41 | 99.99%@0.3μm | 762 | 610 | 65 | 12.5 | 750 | 98 |
| 8 | TGML-Z-E41 | 99.99%@0.3μm | 915 | 610 | 65 | 15.0 | 900 | 98 |
| 9 | TGML-20-E41 | 99.99%@0.3μm | 1220 | 610 | 65 | 20.5 | 1230 | 98 |
| 10 | TGML-Z-E41 | 99.99%@0.3μm | 1500 | 915 | 65 | 39.0 | 2340 | 98 |
| 11 | TGML-Z-E23 | 99.99%@0.3μm | 305 | 305 | 75 | 2.0 | 120 | 88 |
| 12 | TGML-Z-E23 | 99.99%@0.3μm | 457 | 457 | 75 | 5.0 | 300 | 88 |
| 13 | TGML-Z-E23 | 99.99%@0.3μm | 305 | 610 | 75 | 4.5 | 270 | 88 |
| 14 | TGML-10-E23 | 99.99%@0.3μm | 610 | 610 | 75 | 10.0 | 600 | 88 |
| 15 | TGML-Z-E23 | 99.99%@0.3μm | 762 | 610 | 75 | 12.5 | 750 | 88 |
| 16 | TGML-Z-E23 | 99.99%@0.3μm | 915 | 610 | 75 | 15.0 | 900 | 88 |
| 17 | TGML-20-E23 | 99.99%@0.3μm | 1220 | 610 | 75 | 20.5 | 1230 | 88 |
| 18 | TGML-Z-E23 | 99.99%@0.3μm | 1500 | 915 | 75 | 39.0 | 2340 | 88 |
| 19 | TGML-Z-E38 | 99.99%@0.3μm | 305 | 305 | 98 | 2.0 | 120 | 84 |
| 20 | TGML-Z-E38 | 99.99%@0.3μm | 457 | 457 | 98 | 5.0 | 300 | 84 |
| 21 | TGML-Z-E38 | 99.99%@0.3μm | 508 | 508 | 98 | 6.5 | 390 | 84 |
| 22 | TGML-Z-E38 | 99.99%@0.3μm | 305 | 610 | 98 | 4.5 | 270 | 84 |
| 23 | TGML-10-E38 | 99.99%@0.3μm | 610 | 610 | 98 | 10.0 | 600 | 84 |
| 24 | TGML-Z-E38 | 99.99%@0.3μm | 762 | 610 | 98 | 12.5 | 750 | 84 |
| 25 | TGML-Z-E38 | 99.99%@0.3μm | 915 | 610 | 98 | 15.5 | 930 | 84 |
| 26 | TGML-Z-E38 | 99.99%@0.3μm | 1000 | 610 | 98 | 17.0 | 1020 | 84 |
| 27 | TGML-20-E38 | 99.99%@0.3μm | 1220 | 610 | 98 | 20.5 | 1230 | 84 |
| 28 | TGML-Z-E38 | 99.99%@0.3μm | 1500 | 915 | 98 | 39.5 | 2370 | 84 |
Detailed Description
TGML is the ultimate AMC spec in a mini-pleats form factor — controlling both organic and boron contamination simultaneously. Designed for FFUs at sub-14 nm processes where low PD is essential and cleanliness cannot be compromised.
Materials & Construction
| Property | Specification |
|---|---|
| Filter frame | ALUMINUM |
| Media | GLASS PAPER |
| Max. temperature | 60°C |
| Relative humidity | 60%RH |
| Separator | HOT MELT ADHESIVE |
| Gasket | EPDM |
| Grille (downstream) | - |
| Grille (upstream) | - |
| Sealant | POLYURETHANE RESIN |
| Max airflow | Can be calculated on request |
| Max final PD (Pa) | 294 |
Airflow vs Pressure Drop (representative)
Applications
- FFUs in sub-14 nm wafer fabs - FFUs around EUV / DUV equipment - FFUs in photoresist coating zonesSelection Notes
- Low-boron only → BGML is more economical. - Low-organic only → contact for custom. - Both required → choose TGML (top grade).Selection References
Before ordering, verify the efficiency grade, media type, and whether the operating environment fits your requirements.
