GCV Binder-Free Low-Shedding Heat-Resistant Semi-HEPA Filter (350°C)

Product Overview

GCV is a 350°C heat-resistant Semi-HEPA filter with 90% efficiency @ 0.5-1.0 μm. Primarily used as a pre-filter for ATMCU/ATMV main HEPAs, or standalone where sub-HEPA filtration is adequate at high temperature. Key features ・Continuous operation up to 350°C ・90% @ 0.5-1.0 μm (Semi-HEPA class) ・All-inorganic construction, no outgassing ・Common pre-filter for 350°C HEPA systems ・Binder-free construction: no organic adhesive in media or seal — low particle shedding, no siloxane outgassing Target industries：Medical, Pharmaceutical, Electronics, Power generation, Nuclear power

Features & Specifications

No.	Model	Efficiency	W (mm)	H (mm)	D (mm)	Airflow (CMM)	Airflow (CMH)	Initial PD (Pa)
1	GCV-Z-Q-L-FS4	90%@0.5-1.0μm	305	305	150	3.0	180	245
2	GCV-Z-Q-L-FS4	90%@0.5-1.0μm	305	610	150	7.5	450	245
3	GCV-Z-Q-L-FS4	90%@0.5-1.0μm	457	457	150	8.5	510	245
4	GCV-17-Q-L-FS4	90%@0.5-1.0μm	610	610	150	17.0	1020	245
5	GCV-Z-Q-L-FS4	90%@0.5-1.0μm	762	610	150	21.5	1290	245
6	GCV-Z-Q-L-FS4	90%@0.5-1.0μm	915	610	150	26.0	1560	245
7	GCV-Z-Q-L-FS4	90%@0.5-1.0μm	915	760	150	33.5	2010	245
8	GCV-Z-P-L-FS4	90%@0.5-1.0μm	305	305	290	5.5	330	245
9	GCV-Z-P-L-FS4	90%@0.5-1.0μm	305	610	290	13.5	810	245
10	GCV-Z-P-L-FS4	90%@0.5-1.0μm	457	610	290	22.0	1320	245
11	GCV-31-P-L-FS4	90%@0.5-1.0μm	610	610	290	31.0	1860	245
12	GCV-Z-P-L-FS4	90%@0.5-1.0μm	760	760	290	50.0	3000	245

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LINE @baisheng

Email：sales@baisheng-tech.com

Phone：+886-2-25981958

Detailed Description

GCV is the Semi-HEPA option for 350°C environments, used mainly to extend HEPA main-filter life. Simpler construction, lower pressure drop and lower cost than HEPA.

Materials & Construction

Property	Specification
Filter frame	STAINLESS STEEL
Media	GLASS FIBER (Held by wire net)
Max. temperature	350°C (Max. 400°C/1h)
Separator	STAINLESS STEEL
Gasket	GLASS PAPER
Grille (downstream)	-
Grille (upstream)	-
Sealant	GLASS FIBER
Max airflow	Can be calculated on request
Max final PD (Pa)	490

Airflow vs Pressure Drop (representative)

Representative curves for 610×610 mm units. Lower pressure drop than HEPA.

Binder-Free, Low-Shedding Construction

A conventional HEPA bonds and seals its media and frame with polyurethane (PU) or silicone, and those sealants are generally rated for long-term service somewhere in the 100–200°C range. Above that, the adhesive first softens and cracks, releasing organic molecules, then embrittles and flakes under repeated thermal cycling — at which point the filter itself becomes a particle source. GCV uses no organic adhesive anywhere: sealing is done with glass fiber, the frame and separators are stainless steel, and the entire assembly is metal and glass only.

Component	Conventional adhesive HEPA	GCV (binder-free)
Sealant	Polyurethane / silicone	GLASS FIBER
Media bonding	Organic binder	None (glass fiber held by wire net)
Separator	Aluminium foil + hot-melt	STAINLESS STEEL
Outgassing at temperature	Organic molecules, siloxane	None
Shedding after thermal cycling	Rises as adhesive degrades	Stays stable

With no organic adhesive there is nothing to thermally decompose. Two practical consequences follow: - Low particle shedding — degrading, flaking adhesive is the most common source of self-generated particles in high-temperature filters. A binder-free build keeps downstream particle counts from creeping back up as the filter ages through repeated heat-up and cool-down cycles. - No siloxane contamination — silicone seals release siloxane at elevated temperature, and siloxane deposited on wafers, optical surfaces or coated substrates causes hazing and yield loss. Semiconductor, optical coating and OLED processes are particularly sensitive to this. Binder-free construction is easy to overlook on a pre-filter, yet it matters most there: if the upstream stage contains organic adhesive, its outgassing and flaked debris are carried straight into the downstream main HEPA and the process itself — a contamination source placed immediately ahead of the cleanest point in the system. GCV shares the all-inorganic construction of ATMCU/ATMV, so there is no organic break anywhere along the airflow path.