BGML Low-Boron HEPA Filter - NIPPON MUKI | Baisheng Tech
Product IDNM-BGMLNIPPON MUKIStandard HEPA
NIPPON MUKI

BGML Low-Boron HEPA Filter

Product Overview

BGML is a low-boron mini-pleats HEPA filter with 99.99% efficiency @ 0.3 μm. Low-boron glass-fiber media + mini-pleats construction — a low-PD low-boron spec for semiconductor FFU terminal filtration. Key features ・Low-boron glass-fiber media (<10 ppm B) ・HEPA 99.99% @ 0.3 μm ・Mini-pleats construction (low PD) ・Standard for semiconductor FFUs Target industries:Electronics

Features & Specifications

No.ModelEfficiencyW (mm)H (mm)D (mm)Airflow (CMM)Airflow (CMH)Initial PD (Pa)
1BGML-Z-E4199.99%@0.3μm305305652.012098
2BGML-Z-E4199.99%@0.3μm457457655.030098
3BGML-Z-E4199.99%@0.3μm305610654.527098
4BGML-10-E4199.99%@0.3μm6106106510.060098
5BGML-Z-E4199.99%@0.3μm7626106512.575098
6BGML-Z-E4199.99%@0.3μm9156106515.090098
7BGML-20-E4199.99%@0.3μm12206106520.5123098
8BGML-Z-E4199.99%@0.3μm150012206552.5315098
9BGML-Z-E2399.99%@0.3μm305305752.012088
10BGML-Z-E2399.99%@0.3μm457457755.030088
11BGML-Z-E2399.99%@0.3μm305610754.527088
12BGML-10-E2399.99%@0.3μm6106107510.060088
13BGML-Z-E2399.99%@0.3μm7626107512.575088
14BGML-Z-E2399.99%@0.3μm9156107515.090088
15BGML-20-E2399.99%@0.3μm12206107520.5123088
16BGML-Z-E2399.99%@0.3μm150012207552.5315088
17BGML-Z-E3899.99%@0.3μm305305982.012084
18BGML-Z-E3899.99%@0.3μm457457985.030084
19BGML-Z-E3899.99%@0.3μm305610984.527084
20BGML-10-E3899.99%@0.3μm6106109810.060084
21BGML-Z-E3899.99%@0.3μm7626109812.575084
22BGML-Z-E3899.99%@0.3μm9156109815.593084
23BGML-Z-E3899.99%@0.3μm10006109817.0102084
24BGML-20-E3899.99%@0.3μm12206109820.5123084
25BGML-Z-E3899.99%@0.3μm150012209853.0318084

Email:sales@baisheng-tech.com

Phone+886-2-25981958

Detailed Description

BGML combines low-boron construction with the low-PD benefits of mini-pleats — the classic choice for semiconductor ceiling FFUs. Addresses both boron-AMC concerns and energy-efficiency requirements.

Materials & Construction

PropertySpecification
Filter frameALUMINUM
MediaGLASS PAPER
Max. temperature60°C
Relative humidity60%RH
SeparatorHOT MELT ADHESIVE
GasketEPDM
Grille (downstream)-
Grille (upstream)-
SealantPOLYURETHANE RESIN
Max airflowCan be calculated on request
Max final PD (Pa)294

Airflow vs Pressure Drop (representative)

05010015020002004006008001000Air volume (m³/h)Pressure drop (Pa)BGML 65mmBGML 75mmBGML 98mm
Three representative depths shown. Deeper variants have lower PD.

Applications

- Semiconductor ceiling FFUs - Lithography bay FFUs in wafer foundries - Cleanroom FFUs in memory fabs

Selection Notes

- High airflow → BGMC (separator type). - Low PD → BGML (this model). - Low-organic also required → TGML.

Selection References

Before ordering, verify the efficiency grade, media type, and whether the operating environment fits your requirements.